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Rigid-Flex PCBs

Innovative rigid-flex PCB solutions combining rigid and flexible circuit technologies for 3D packaging, dynamic flexing, and reduced interconnect complexity.

Integrated Rigid-Flex PCB Solutions

Rigid-flex PCBs integrate rigid circuit boards with flexible circuit substrates, eliminating connectors, cables, and solder joints. The result is a single interconnected assembly that can be folded, bent, or twisted to fit unique 3D enclosures while maintaining superior electrical reliability.

Our rigid-flex manufacturing combines years of experience in both rigid PCB and flex circuit production, ensuring seamless integration, precise layer registration between rigid and flex sections, and exceptional reliability through thousands of flex cycles.

  • Combination of rigid (FR-4) and flexible (Polyimide) sections
  • Dynamic flex capability: 100,000+ flex cycles
  • Static flex: unlimited (bend-to-install)
  • Multi-layer rigid sections up to 20 layers
  • Flex layers: 1-6 layers (adhesive & adhesiveless)
  • Stiffeners: FR-4, Polyimide, or metal (stainless steel/aluminum)
  • Coverlay vs. solder mask on flex sections
  • Electroless nickel immersion gold (ENIG) on exposed pads

Technical Specifications

Rigid Section

  • Rigid Layers: 2 - 20 layers
  • Rigid Material: FR-4, High-Tg FR-4, Polyimide
  • Board Thickness (assembled): 0.3mm - 4.0mm
  • Copper Weight: 0.5oz - 4oz
  • Min Track/Spacing: 0.075mm / 0.075mm (3/3 mil)
  • Via Types: Through-hole, blind, buried

Flex Section

  • Flex Layers: 1 - 6 layers
  • Flex Material: Polyimide (adhesive / adhesiveless)
  • Flex Thickness: 0.05mm - 0.4mm
  • Bend Radius (Dynamic): 25× flex thickness (min)
  • Bend Radius (Static): 10× flex thickness
  • Flex Cycles: 100,000+ (dynamic)

Processing Capabilities

  • Stiffeners: FR-4, Polyimide, Stainless Steel, Aluminum
  • Coverlay: Polyimide with adhesive (on flex areas)
  • Min Drill: 0.15mm (rigid), 0.2mm (flex)
  • Surface Finish: ENIG, OSP, Immersion Silver
  • Bond Ply: Acrylic / Epoxy adhesive, no-flow prepreg
  • Max Panel: 500mm × 600mm

Quality & Testing

  • Standards: IPC-6013 Class 2/3 (Flex & Rigid-Flex)
  • Electrical: 100% flying probe
  • Flex Cycle Test: IPC-TM-650 method 2.4.3.1
  • Peel Strength: >0.7 N/mm (flex copper)
  • Certification: UL 796, ISO 9001:2015
  • RoHS / REACH: Fully compliant

Applications

Camera Modules

Flexible interconnects for smartphone camera modules, allowing compact folding and precise alignment of imaging sensors.

Medical Devices

Implantable and portable medical electronics requiring high reliability in compact, body-conforming packages.

Printers & Peripherals

Dynamic flex circuits for printer head assemblies, scanner units, and other office automation with moving parts.

Consumer Electronics

Foldable smartphones, wearables, tablets, and gaming devices leveraging rigid-flex for thinner, lighter designs.

Automotive Electronics

LED headlight assemblies, sensor modules, and infotainment systems benefiting from reduced connector count and vibration resistance.

Aerospace & Defense

Missile guidance, avionic displays, and satellite communication systems requiring extreme reliability in tight 3D enclosures.