State-of-the-art equipment and processes to meet the most demanding PCB requirements
Up to 32 layers with blind and buried vias, controlled impedance, and high-density interconnections.
Laser-drilled microvias (0.1mm), fine line technology (3/3 mil), and any layer interconnection.
Rogers, Taconic, and other high-frequency materials for RF and microwave applications.
Combination of rigid and flexible circuits for 3D packaging and dynamic flexing applications.
Metal core (aluminum/copper) PCBs and heavy copper (up to 20oz) for heat dissipation.
ENIG, Immersion Silver/Tin, OSP, Hard Gold, and other specialized surface treatments.
Comprehensive manufacturing specifications across all product categories
| Parameter | Capability | Details |
|---|---|---|
| Layers | 1-32 layers | Standard and high-layer count multilayer boards |
| Board Thickness | 0.2mm - 6.0mm | Including ultra-thin and thick boards |
| Copper Weight | 0.5oz - 20oz | Standard to heavy copper for power applications |
| Min Trace/Space | 3mil/3mil | Fine line technology for high-density designs |
| Min Hole Size | 0.15mm (mech), 0.1mm (laser) | Mechanical and laser-drilled microvias |
| Materials | FR-4, Rogers, Polyimide, Aluminum | Wide range of substrate materials |
| Surface Finish | HASL, ENIG, OSP, Immersion Ag/Sn | Multiple surface treatment options |
| Panel Size | Up to 600mm × 600mm | Large format manufacturing capability |
| Solder Mask | All colors available | Green, red, blue, black, white, yellow, etc. |
Comprehensive quality control processes to ensure defect-free delivery
High-resolution AOI systems detect defects like shorts, opens, and spacing violations with micron-level accuracy.
Electrical testing of all nets for continuity and isolation to ensure circuit integrity.
Non-destructive inspection of inner layers, vias, and BGA solder joints for hidden defects.
Time-domain reflectometry for controlled impedance boards to ensure signal integrity.
Thermal cycling and solder float tests to verify reliability under temperature extremes.
100% manual visual inspection by trained technicians as final quality gate before shipping.